AVC ConfidentialAVC Confidential A A unit of unit of AVCAVC TechnologyTechnology specializing in Thermoelectric Devicesspecializing in Thermoelectric Devices Spencer Shen Chairman/CEO 20062006AVC ConfidentialAVC Confidential2 THEORYTHEORY Thermoelectric Cooler (TEC)Thermoelectric Cooler (TEC) Thermoelectric Cooler (TEC) PELTIER EFFECT be called after a french watchmaker (1785-1845.), who discovered it in 1834. How does Peltier effect work? If you put a drop of water in the hollow on the joint of 2 conductors or semiconductors, e.g. Sb and Bi, and switch on the current, the drop would freeze If the reverse direction of the current is applied, the drop would melt. 20062006AVC ConfidentialAVC Confidential3 Heat Sink Technology Heat Sink Technology - -Heat Pipe Press Fit Heat Pipe Press Fit v.sv.s SolderingSoldering TEC Structure A Peltier module consists of semiconductors mounted successively, which form p-n- and n-p-junctions. Heat is absorbed at the cold junction by electrons as they pass from a low energy level in the p-type element, to a higher energy level in the n-type element. At the hot junction, energy is expelled to a thermal sink as electrons move from a high energy N element to a lower energy P element. 20062006AVC ConfidentialAVC Confidential4 Thermoelectric Cooler (TEC)Thermoelectric Cooler (TEC) Heat Absorbed Heat Rejected Negative (-) Electrical Conductor (Copper) p-Type Semiconductor n-Type Semiconductor Electrical Insulator (Ceramic) A module contains several P-N couples that are connected electrically in series and thermally in parallel. Positive (+) 20062006AVC ConfidentialAVC Confidential5 Dothan Processor TEC Characteristic Definitions: Imax Input current resulting in greatest T ( Tmax) Amps N Number of thermocouples (p- and n-type pairs) QmaxMaximum amount of heat that can be absorbed at cold face (occurs at I=Imax, T = 0C) Watts ThTemperature of the TEC hot face during operation C TcTemperature of the TEC cold face during operation C TmaxMaximum temperature difference a TEC can achieve (occurs at I=Imax, Qc = 0) C VmaxVoltage at T ( Tmax) Volts GRAPHGRAPH TE Devices ?CP SERIES ?For higher current, larger heat pumping applications ?The standard for consumer product and industrial cooling ?Low-Cost, High-Performance ?Temp up to 80oC HT SERIES Unique patented technology works at +225oC Superior cycling capacity Generate power from waste heat! PT SERIES Porch style ceramic for increased heat dissipation Strong porch style lead attachments Center Hole SERIES Features center hole for transmission of light, wires, probes or other hard ware through the TEC Round or square configurations available TE Devices Ultra SERIES High heat-pumping capacity within small surface area High efficiency Strong, porch style lead attachment Large hot side ceramic for extra heat dissipation Multistage Cascade Ideal for requirements with large temperature differentials (T) up to 131 Low Heat Load Applications 15 Watts Needs Vacuum environment to achieve ultra-low temperatures OptoTEC SERIES Miniature Thermoelectrics, Dimensions15mm, Heat Load1kw) Can be used in any orientation, Small size Solid State (no moving parts), Cooling below ambient Temperature control, Heating capability Compatible with heat sinks, cold plates, and heat pipes TEC Disadvantages Advantages Method TelecomApplication Pump Diode Lasers, Butterfly Package, Wireless Package. Automotive Automotive Application Cooling & warming cushion/mattress IT Product Applications CPU cooling，VGA cooling