HP 00016 00 06 Apr 2010 HP Restricted 1 HP Standard 016 0 General Specification for Printed Circuit Assembly and Rework Processes Owner Kris Troxel Responsible Group Global Engineering Services Document Identifier HP 00016 00 Revision and Date A 06 Apr 2010 Abstract This standard describes critical tin lead Sn Pb and lead free Pb free printed circuit assembly and rework process parameters together with specifications or guidelines for their values Applicability The requirements in this specification apply to all suppliers of electronic manufacturing services EMS contract manufacturers CMs suppliers of finished PCAs and suppliers of complete electronic products to HP Status Approved Copyright 2010 Hewlett Packard Development Company L P This is an uncontrolled copy when in printed form Table of Contents 1 Purpose 2 Scope 3 Limitations 4 General Obligations 5 Document Hierarchy 6 Critical PCA Issues 6 1 PCA Quality and Workmanship Standards 6 2 PCA Cleanliness and Contamination 6 3 Mechanical Strain 6 4 Factory Environment 7 Component and PCB Requirements 8 Common Assembly Subprocesses 8 1 Stencil Print 8 2 Glue Processes 8 3 Component Placement 8 4 Solder Reflow 8 5 Wave Solder 8 6 PCA Wash For Water Clean Fluxes Only 8 7 De Panel 8 8 Press Fit 8 9 Protective Tape 8 10 Rework 8 11 Heat Sink and Thermal Solution Attach 8 12 In circuit and Functional Test 8 13 Handling and Shipping Packaging 8 14 Moisture Sensitive Component Handling HP 00016 00 06 Apr 2010 HP Restricted 2 8 15 Environment Rules 8 16 Electrostatic Discharge 8 17 Inspection and X ray Appendix A Minimum Solder Paste Volume Requirements for Core Electronics Chipsets CECs Referenced Documents 1 Purpose This standard describes critical printed circuit assembly PCA and rework process parameters with specifications or guidelines for their values Other relevant specifications are cited These specifications and guidelines are a supplement to general knowledge of manufacturing engineering They may be modified for specific product needs However deviation from these specifications and standards is permitted only with the approval of the responsible HP product engineering group or HP Global Engineering Services GES 2 Scope The requirements in this specification apply to all suppliers of electronic manufacturing services EMS contract manufacturers CMs suppliers of finished PCAs and suppliers of complete electronic products to HP 3 Limitations This document covers certain existing assembly technologies It does not describe the specific procedures or recommend specific processing materials used in assembly or rework except where noted It also does not describe product materials such as printed circuit board PCB laminates or component specifications 4 General Obligations As a minimum a supplier must present to HP how the requirements outlined in this document are incorporated into its processing and how the specifications will be met Acceptance of this document by the supplier constitutes agreement to comply with this condition 5 Document Hierarchy If any conflicts exist between documents the following order of precedence applies Purchase order Fabrication drawing Group or Product PCA or Rework Process Specifications This document HP 00016 00 Industry standards such as J STD 001 6 Critical PCA Issues 6 1 PCA Quality and Workmanship Standards All finished PCAs must meet the final quality and workmanship criteria defined in IPC A 610 Class 2 and the HP document EL MF610 01 Printed Circuit Assembly Acceptability Standards Additions and Exceptions to IPC A 610D 930 610 HP 00016 00 06 Apr 2010 HP Restricted 3 6 2 PCA Cleanliness and Contamination Residues left on an assembly after soldering or cleaning are often mildly ionic and acidic These residues can cause product failure The possible failure modes caused by those residues include a Corrosion of the PC board b Shorting between metal traces due to dendritic growth c Functional degradation of the ICs due to ionic contamination diffusing into the active junctions of the die As such all solder pastes and fluxes both individually and in combination used in the production of HP products must meet the requirements of the appropriate test specification in the current revision of EL MF862 07 HP Approved Material List for Solder Assembly AML All Pb free solders must meet the requirements of the appropriate specification the EL MF862 08 HP Tin Silver Copper Sn Ag Cu Solder Paste Standard No clean fluxes described in the AML do not require cleaning For the final assembly the following specifications must be met Parameter Specification Comments Cleanliness by SIR 100 M after stressed IPC TM 650 2 6 3 3 b Certification is required once for each no clean processing chemical combination Any change to any process chemical requires recertification Certification is required once for each water wash process that is individual washer Any change to equipment or process requires recertification Required for all materials used on all