HDI Manufacturing Process Flow,Pre-engineering,Pattern imaging,Etching,Laminating,Drilling,Desmear,Cu plating,Hole plugging,Cu plating,Belt Sanding,Laser Ablation,Mechanical drilling,Cu plating,Solder Mask,Gold plating,Routing,Electrical test,Pattern imaging,Hole counter,Shipping,Visual inspection,* Raw material (Thin Core,Copper,Prepreg.),Raw Material : FR-4 (Difuntional,Tetrafuntional) Supplier : EMC ,Nan-Ya Sheet size : 36”*48” , 40”*48” ,42”*48 Core Thickness : 0.003”,0.004”,0.005”,0.006” 0.008”,0.010”,0.012”,0.015” 0.021”,0.031”,0.039”,0.047” Copper Foil : 1/3 oz,1/2 oz,1.0 oz,2 oz Prepreg type : 1080,2113,2116,1506,7628,7630,4. 內層線路製作(顯影)(Develop),5. 內層線路製作(蝕刻)(Etch),6. 內層線路製作(去膜)(Strip Resist),7.黑氧化 ( Oxide Coating),8. 疊板 (Lay-up),9. 壓合 (Lamination),10. 鑽孔 (Drilling),11. 電鍍Desmear & Copper Deposition,12. 塞孔(Hole Plugging),13. 去溢膠 (Belt Sanding),14. 減銅 (Copper Reduction) Option,15. 去溢膠 (Belt Sanding) Option,16. 外層壓膜 Dry Film Lamination (Outer layer),17. 外層曝光 Expose,18. After Exposed,19. 外層顯影 Develop,20. 蝕刻 Etch,20. 去乾膜 Strip Resist,21.壓合 (Build-up Layer Lamination),RCC (Resin Coated Copper foil),21. 護形層製作 (壓膜)(Conformal Mask),22. 護形層製作 (曝光)(Conformal Mask),Before Exposure,After Exposure,23.護形層製作 (顯像)(Conformal Mask),24. 護形層製作 (蝕銅) (Conformal Mask),25.護形層製作(去膜) (Conformal Mask),26. 雷射鑽孔 (Laser Ablation)及機械鑽孔,27. 機械鑽孔 (Mechanical Drill),28. 電鍍(Desmear & Copper Deposition),29. 外層線路製作 (Pattern imaging),壓膜(D/F Lamination),曝光(Exposure),顯像(D/F Developing),蝕銅 (Etching),去膜(D/F Stripping),30. 防焊(綠漆)製作 (Solder Mask),WWEI 94V-0,R105,31. S/M 顯像 (S/M Developing),32. 印文字 (Legend Printing),33. 浸金(噴錫)製作(Electroless Ni/Au , HAL),Dedicate or universal Tester,Flying Probe Tester,34. 成型 (Profile),35. 測試 (Electrical Testing),36. 終檢 (Final Inspection),37. O.S.P. (entek plus Cu_106A.) Option,LASER BLIND & BURIED VIA LAY-UP,A = THROUGH VIA HOLE (導通孔),B = BURIED VIA HOLE (埋孔),C = One Level Laser Blind Via (雷射盲孔 ),LASER BLIND & BURIED VIA LAY-UP,BURIED VIA AND LASER BLIND VIA OPTION (雷射盲埋孔之選擇),D,C,C,D = Two Level Laser Via (雷射盲孔 ),C,D,C,B-STAGE,FR-4 Core,RCC,A,B,B,A,BURIED VIA LAY-UP,A = THROUGH VIA HOLE (導通孔),B = BURIED VIA HOLE (埋孔),C = BLIND VIA HOLE (盲孔 ),D = BLIND HOLE MLB VIA (多層盲孔),BLIND VIA LAY-UP,BLIND VIA SEQUENTIAL LAY-UP,A,B,B,A,RESIN,B-STAGE,BLIND AND BURIED VIA OPTION (盲 埋 孔 之 選 擇 ),D,A,C,C,E = VIA IN PAD (VIP) (導通孔在pad裡面),E,Conventional PCB,Photo-Imageable Dielectric (PID),Conventional PCB,Blind Via PCB,Q & A,END,