1,Double Side ( Non-PTH ) PCB,Design Guideline,Presentation,2,Objective,Cost Saving Double side ( Non- PTH ) PCB can saving 40% 50% compare with Double side ( PTH ) PCB * Base on FR-4 PCB Material,3,Types of PCB Material,FR-4- Preferred CEM-3- Acceptable CEM-1- Limited Acceptable FR-1- Limited Acceptable,5,Guideline,Use same type of “Connectors” for PTH function and jumper wire is preferred. It should be separate to individual parts for connection cant use the leads of component at the same time. * If necessary, AI types component is acceptable, except “Glass” type components.,6,Guideline (continues),It must place on low profile component area and under on components is unacceptable. The marco of solder pad must maintain * 50% opening on hole of component at components side. * The opening can provide the air release function to improve solderability for Wave soldering process.,7,The Concept of Non-PTH Design,8,The limitation of “Connector”,50 % opening on holes of component leads,- Solder Pad,9,The limitation of “Connector”,Body of component + 4 mm eg. 1/4W small size resistor the pitch is 7.5 mm ( recommend pitch is 7.5, 10, 12.5, 15 mm ),- Pitch of components,10,Process Flow for Non-PTH Design,DET-5 AI RI SMD Components side soldering HI DCGP AI Components side soldering RI SMD HI,11,Manufacturing for “Connector”,Manual soldering,Auto soldering M/C,DET-5 only,12,Auto Soldering M/C Processing,13,Connection Evolution - 1,Jumper wire,Old,New,14,Connection Evolution - 2,AI types component,Old,New,15,Connection Evolution - 3,Rivet ( eyelet ),Old,New,16,Connection Evolution - 4,Unacceptable ( some potential damage the coating on soldering process due to deviation of height & coating of RI types comp. ),17,Disadvantage of Non-PTH Design,Extra Labor Time & Handling Interrupted Process Flow Increasing WIP units & area Risk on Quality & Reliability depends on Workmanship Standard,18, END ,Double Side ( Non-PTH ) PCBPresentation,