MEMS digital output motion sensor low-power high performance 3-axes “DSC-XYZ” accelerometer Key Features Supply voltage, 1.62V to 3.6V For 3x3x0.9 mm LGA-10 package User selectable range, 2g, 4g, 8g, 16g User selectable data output rate Digital I2C output interface 14 bit resolution Low power consumption 1 Programmable interrupt generator with independent function for motion detection Free-fall detection Embedded self-test function Factory programmable offset and sensitivity RoHS compliant Applications User interface for mobile phone and PMP Display orientation Gesture recognition Active/inactive monitoring Free-fall detection Double/ Click recognition Power management Vibration monitoring Inclination and tilt sensing Pedometer da380 Product Overview The da380 sensor is the low power high performance capacitive three-axis linear accelerometer developed by micro-machined technology. The device is available in a 3x3x0.9 mm land grid array (LGA) and it is guaranteed to operate over an extended temperature range from -40C to +85C. The sensor element is fabricated by single crystal silicon with DRIE process and is protected by hermetically sealed silicon cap from the environment. The device features user selectable full scale of 2g/ 4g/ 8g/ 16g measurement range with data output rate from 1Hz to 1 kHz with signal condition, temperature compensation， self-test, motion detection imbedded. The da380 has a self-test mode for user to check the functioning of the sensor and a power-down mode that makes it good for handset power management. Flexible interrupt provided greatly simplify the algorithm for various motion status detections. Standard I2C interface is used to communicate with the chip. Content 1 Block diagram and pin description . 9 1.1 Block diagram . 9 1.2 Pin description . 9 2 Mechanical and electrical specifications . 11 2.1 Mechanical characteristics . 11 2.2 Electrical characteristics . 12 2.3 Absolute maximum ratings . 13 3 Communication interface . 14 3.1 Communication interface Electrical specification . 14 3.1.1 I2CElectrical specification . 14 3.2 Digital interface operation . 15 3.2.1 I2C Operation. 15 4 Terminology and functionality. 17 4.1 Terminology . 17 4.1.1 Sensitivity . 17 4.1.2 Zero-g level . 17 4.2 Functionality . 17 4.2.1 Power mode . 17 4.2.2 Sensor data . 18 4.2.3 Self-test . 18 4.2.4 Offset compensation .