C-System Introduction will cover,Role & Responsibility (R&R) Process Cx Stage: C0: Proposal phase 構想階段 C1: Planning phase 規劃階段 C2: R&D Design phase 設計階段 C3: Lab Pilot Run phase 樣品試作階段 C4: Eng Pilot Run phase 工程試作階段 C5: PD Pilot Run phase 試產階段 C6: Mass Production phase 量產階段,Role & Responsibility,- Wistron Case,Role & Responsibility,- Wistron Case,Role & Responsibility,- Wistron Case,Role & Responsibility,- Wistron Case,Role & Responsibility,- Wistron Case,Role & Responsibility,- Wistron Case,Wistron C-System Quality Control,Proposal Phase,Planning Phase,R&D Design Phase,Lab Pilot-run Phase,Engineering Pilot-run Phase,Production Pilot-run Phase,Mass Production Phase,C0,C1,C2,C3,C4,C5,Check Point,Wistron C- Phase,Availability,Develop,Plan,Launch,FAI & SPC MTBF Demo CIP/CLCA Pareto Analysis EWG Ready AFR,Test Reports Pre-QVL Ready Diagnostics Program Bug List & Action DCN/ECN/ECR FAI report PFMEA SQRC,Training MTBF Review QMP/QPA/QSA FPYR PPAP Serviceability,Design,Test Plans Integrate Design Review Signal Quality DFX Index Initial Supplier Audit Memorandum DFMEA Simulation MTBF Estimate MVP,Concept/Proposal,MRS Definition Scope SCE,Product Life Cycle,MDRR/C4 Go/ No Go?,MRR/C5 Go/ No Go?,C6,OOB/OBA,ORT/Stress,EWG/FQH,AFR/DOA,New C System Architecture,Progress,Time,Detail Activities,Subject Scope Definition Procedure .,Activities Definition,Record & Report,Format Definition,Escalation Rule,Measurement Standard,Project Management & System Maintenance,New C System Product Development,Proposal Phase,Planning Phase,R&D Design Phase,Lab Pilot Run Phase,Eng. Pilot Run Phase,Production Pilot run Phase,Mass production phase,C2 meeting,C3 meeting,C4 meeting,C5 meeting,C3 checklist HW DV test report SW FV test report ME test report Reliability test report (prel.) ME/Artwork/packing drawing PAL/ROM data listing C3 manufacturability review report Sample approvestatus & bug list review,C4 checklist BOM QVL Time standard System BIOS/KBCFW release S/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R report PCBA WS P/R report ME Eng. P/R report Eng. P/R QA review report Schematics & jumper setting Test program/Procedure SOP for PCBA/FA User manual R/N Packing standard Compatibility test report Reliability and C4 Reliability test report Key Component verification Spare parts list,C5 checklist Service Guide EMC Safety report PD P/R yield rate analysis rpt PCBA inspection instruction Product inspection instruction MTBF DEMO test report,PM,PM,C0 meeting,C1 meeting,PM,C1 checklist Inventiondisclosure Time schedule Project team Model number define Green design guide and reviewcheck list Non QVL/Sampleapproval request form,C2 checklist PES EMC/Safety Request Form BOM/QVL(Prel.) PCB Layout (prel.) Outsourcing modulespecification,PM,NPI,C0,C1,C2,C3,C4,C5,C6,C6 meeting,GCSD,C6 checklist Product phaseout notice,C0 Checklist MRS,C0/PM,C0 Meeting,C0-工作重點及檢核項目,New C System Product Development,Proposal Phase,Planning Phase,R&D Design Phase,Lab Pilot Run Phase,Eng. Pilot Run Phase,Production Pilot run Phase,Mass production phase,C2 meeting,C3 meeting,C4 meeting,C5 meeting,C3 checklist HW DV test report SW FV test report ME test report Reliability test report (prel.) ME/Artwork/packing drawing PAL/ROM data listing C3 manufacturability review report Sample approvestatus & bug list review,C4 checklist BOM QVL Time standard System BIOS/KBCFW release S/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R report PCBA WS P/R report ME Eng. P/R report Eng. P/R QA review report Schematics & jumper setting Test program/Procedure SOP for PCBA/FA User manual R/N Packing standard Compatibility test report Reliability and C4 Reliability test report Key Component verification Spare parts list,C5 checklist Service Guide EMC Safety report PD P/R yield rate analysis rpt PCBA inspection instruction Product inspection instruction MTBF DEMO test report,PM,PM,C0 meeting,C1 meeting,PM,C0 Checklist MRS,C2 checklist PES EMC/Safety Request Form BOM/QVL(Prel.) PCB Layout (prel.) Outsourcing modulespecification,PM,NPI,C0,C1,C2,C3,C4,C5,C6,C6 meeting,GCSD,C6 checklist Product phaseout notice,C1 checklist Inventiondisclosure Time schedule Project team Model number define Green design guide and reviewcheck list Non QVL/Sampleapproval request form,C1/PM,C1 Meeting,C1-工作重點及檢核項目,Case - bottle Coca in England,開採鋁礦,一噸鋁土提鍊半噸氧化鋁 半小時加工,半噸氧化鋁熔煉成1/4噸金屬鋁 再加工二週成鋁錠,瑞典或梛威 熔爐工廠,澳大利亞,澳大利亞 化學還原工廠,加熱至華氏900度 壓延成1/8 inch薄片,瑞典和德國 壓延廠,船運一個月,冷軋成1/80 inch薄片,冷軋廠,英國易開罐廠,成型，清洗，烘乾，防鏽,裝填，印刷,英國可樂廠,消費,鋁罐回收儘16%,Ecological Rucksack (生態包袱),生產一片半導體晶片所產生之廢料為產品重量之十萬倍 生產一台筆記型電腦所產生之廢料為產品重量之四千倍 生產一公升佛羅里達橘子汁需要兩公升汽油及一千公升之水 生產一噸紙需用掉九十八噸之其他資源 資料來源 : 綠色資本主義 天下出版社,EU RoHS Directive,指令期程 2003.01.27 指令發布 2003.02.13 歐盟公報發行,指令生效 2004.08.13 轉為會員國當地法律,法規或行政指令 2006.07.01 新投入之產品不得含有禁用物質 指令要求/禁用項目 鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯苯(PBB) 多溴化二苯乙醚(PBDE),(The restriction of the use of certain hazardous substances in electrical and electronic equipment),EU