Placement Module Course description,Course code PNG-021935,Placement Module Course description,Target audience : CME or CQE that will engage customer issues,Placement Course Description,Ch-0: Course Description 5 min Ch 1: Placement Module Overview 30 min Describe placement module functionality and features Define different types of placement equipments available Describe the placement main systems Understand the placement module future key challenges Ch 2: SPEC OVERVIEW15 min Find the appropriate spec for the placement module. Navigate through the spec and use it as a reference document. Educate how to understand Intel process and applied the knowledge when dealing with customers. Ch-3: Process Control System20 min Understand what is Process Control System Identify process control system used by placement module owner,Placement Course Description,Ch 4: Critical to Function Parameter (CTFP) 20 min Identify major parameter used for the placement module Define the impact of the major parameter Ch 5: Response Flow Check list (RFC) e.g. brittle fracture (Adhesive failure), mechanical fatigue. Potential areas of failure: Shipping Handling Areas of Changes for Solution: Improvement on adhesion force at interface. Enabling Thermal Solution (WSHS & RM type to restrain bending around package) Board Configuration (Stiffeners to restrain board bending),BGA Open Failure Mode G(a) Brittle Fracture,BGA Open Failure Mode G(b) Fatigue Fracture,Failure Mechanism: Cohesive failure fracture in the solder (solder crack as below) due to CTE mismatch Thermo-mechanical Fatigue Failure. Potential areas of failure: Package power up & power down test for high number of cycle. Package after in-used for long cycle. Areas of changes to improve fatigue life: Package & Board Design (Type of Pad Design, Pad Size Package and Board, Ball Population Pattern, Die Size, Solder Ball Diameter) Enabling thermal solution design (Loading, Span),BGA Open Failure - Mode H,Mode H: Non-Wet Signature: Interface between solder paste and BGA ball not wetted Solder paste reflowed properly and wetted to PCB pad In some cases, failed joints may be associated with elongated or column solder joints adjacent to the signature Lateral shifting of the BGA with respect to the pad, is also present in some cases A modified profile cant improve the situation but increased paste volume may have a positive effect. Potential areas of failure: Organic contamination on BGA ball surface prior to reflow Dynamic package warpage during reflow,REVIEW & SUMMARY,SJR study is essential to provide a better understanding of issues that both the design and manufacturing face by exploring the nature of the reliability hazard, solder joint design parameters,material properties, and a solder fatigue model Mode D is the only defect that is closely linked to Placement module,Glossary,本资料来源,更多资料请访问精品资料网(),