NOTE : Specification subject to change without notice. 2015/9/7 1. Summary (a) RoHS Compliant & Halogen Free (b) Applications: All high-density boards(c) Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices (d) Operation Current: 0.01A0.20A(e) Maximum Voltage: 9V60VDC(f) Temperature Range : -40 to 85 2. Agency Recognition UL: File No. E211981T V: File No. R50090556 3. Electrical Characteristics (23 ) Part Number Hold Current Trip Current Rated Voltage Max Current Typical Power Max Time to Trip Resistance Current Time RMIN R1MAX IH, A IT, A VMAX, VDC IMAX, A Pd, W A Sec Ohms Ohms 0.01 0.03 60 40 0.5 0.20 1.00 15.00 100.00 0.02 0.06 60 40 0.5 0.20 1.00 12.00 70.00 0.03 0.09 30 40 0.5 0.20 1.00 6.00 50.00 0.04 0.12 24 40 0.5 0.20 1.00 4.00 40.00 0.05 0.15 15 40 0.5 0.50 0.10 3.80 30.00 0.10 0.25 15 40 0.5 0.70 0.10 0.90 8.00 0.12 0.30 9 40 0.5 0.80 0.10 1.10 5.80 0.16 0.40 9 40 0.5 1.00 0.10 1.00 4.20 0.20 0.45 9 40 0.5 2.00 0.10 0.55 3.50 IH=Hold current-maximum current at which the device will not trip at 23 still air. IT=Trip current-minimum current at which the device will always trip at 23 still air. V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23 still air environment. RMIN=Minimum device resistance at 23 prior to tripping. R1MAX=Maximum device resistance at 23 measured 1 hour after tripping or reflow soldering of 260 for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Surface Mountable PTC Resettable Fuse:SMD0603 SeriesSMD001-0603SMD002-0603SMD003-0603SMD004-0603SMD005-0603SMD010-0603SMD012-0603SMD016-0603SMD020-0603 NOTE : Specification subject to change without notice. 2015/9/7 4. SMD Product Dimensions (Millimeters) Part Number A B C D E Min Max Min Max Min Max Min Max Min Max 1.40 1.80 0.45 1.00 0.35 0.85 0.10 0.50 0.08 0.40 1.40 1.80 0.45 1.00 0.35 0.85 0.10 0.50 0.08 0.40 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 5. Thermal Derating Curve 0%50%100%150%200%-40 -20 0 20 40 60 80PercentofRated Hold andTrip CurrentAmbient Temperature ( )SMD0603 SeriesSMD001-0603SMD002-0603SMD003-0603SMD004-0603SMD005-0603SMD010-0603SMD012-0603SMD016-0603SMD020-0603 NOTE : Specification subject to change without notice. 2015/9/7 D 6. Typical Time-To-Trip at 23 7. Material Specification Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 8. Part Numbering and Marking System Part Numbering System Part Marking System S M D 0603 Current Rating Example Warning: -Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame. -PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. 甲、 -Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance. Part Identification A B=C=D=E=F=G=H=I=X=Y=Z=A=B=D=E=F=G=0.0010.010.11101000.01 0.1 1 10Time-to-Trip(s)Fault Current (A)A B C D E F GHI =SMD001-0603SMD002-0603SMD003-0603SMD004-0603SMD005-0603SMD010-0603SMD012-0603SMD016-0603SMD020-0603SMD001-0603SMD002-0603SMD003-0603SMD004-0603SMD005-0603SMD010-0603SMD012-0603SMD016-0603SMD020-0603 NOTE : Specification subject to change without notice. 2015/9/7 9. Pad Layouts、 Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each SMD 0603 device Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 /second max. Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) 150 200 60-180 seconds Time maintained above: Temperature(TL) Time (tL) 217 60-150 seconds Peak/Classification Temperature(Tp) : 260 Time within 5 of actual Peak : Temperature (tp) 20-40 seconds Ramp-Down Rate : 6 /second max. Time 25 to Peak Temperature : 8 minutes max. Note 1: All temperatures refer to of the package, measured on the package body surface. Reflow Profile Pad dimensions (millimeters) Device A Nominal B Nominal C Nominal SMD0603 Series 0.80 0.60 0.80 Solder reflow Due to “Lead Free” nature, Temperature and Dwelling t