All rights reserved. ANTTMis a trademark of Dynastream Innovation Inc.Reproduction in whole or in part is prohibited without the prior written permission of the copyright holder.June 2010nRF24AP2 nRF24AP2-1CH, nRF24AP2-8CHSingle-chip ANTTMultra-low power wireless network solutionProduct Specification v1.2Key Features Second generation single chip ANT solution nRF24AP2-1CH supports 1 ANT (logic) channel ideal for sensors nRF24AP2-8CH supports up to eight ANT (logic) channels ideal for hubs World wide 2.4 GHz ISM band operation Fully embedded, enhanced ANT protocol stack True ultra-low power operation Typically years of battery lifetime on a coin cell Built-in device search and pairing Built-in timing and power management Built-in interference handling Configurable channel period 5.2 ms - 2 s Broadcast, Acknowledged and Burst communication modes Burst data rate up to 20 kbps Simple to complex network topologies:Peer-to-peer, star, tree and practical mesh Supports public, private and managed networks Support for ANT+ device profile implementations enabling multivendor interoperability Fully interoperable with nRF24AP1 and Dynastream ANT chipset / module based products and other nRF24AP2 variants Simple asynchronous/ synchronous host interface Single 1.9 - 3.6V power supply RoHS compliant 55 mm 32-pin QFN package Low cost external 16 MHz crystal Optional on-chip 32.768 kHz crystal oscillatorApplicationsSports Wellness Home health monitoring Home/industrial automation Environmental sensor networks Active RFID Logistics/goods tracking Audience-response systemsnRFAP2 Product SpecificationLiability disclaimerNordic Semiconductor ASA reserves the right to make changes without further notice to the product to improve reliability, function or design. Nordic Semiconductor ASA does not assume any liability arising out of the application or use of any product or circuits described herein.All application information is advisory and does not form part of the specification.Limiting valuesStress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the specifications are not implied. Exposure to limiting values for extended periods may affect device reliability.Life support applicationsNordic Semiconductors products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Nordic Semiconductor ASA customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Nordic Semiconductor ASA for any damages resulting from such improper use or sale.Contact detailsFor your nearest dealer, please see www.nordicsemi.com.Main office:Otto Nielsens veg 127004 TrondheimPhone: +47 72 89 89 00 Fax: +47 72 89 89 89www.nordicsemi.comDatasheet statusObjective product specification This product specification contains target specifications for Nordic Semiconductors product development.Preliminary product specification This product specification contains preliminary data; supplementary data may be published from Nordic Semiconductor ASA later.Product specification This product specification contains final product specifications. Nordic Semiconductor ASA reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.2Revision 1.2nRFAP2 Product SpecificationRoHS statementNordic Semiconductors products meets the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substances (RoHS). Complete hazardous substance reports as well as material composition reports for all active Nordic Semiconductor products can be found on our web site www.nordicsemi.com.Revision HistoryDate Version DescriptionApril 2010 1.1 Updated schematics. Added section 2.4.1 on page 12, updated sections 8.1 on page 43 and 8.2 on page 46.June 2010 1.2 Updated sections 2.1 on page 8 and 2.4 on page 11, Table 4. on page 22, section 4.2.2 on page 16, section 8.1 on page 43, and chapter 11 on page 49.3Revision 1.2nRFAP2 Product SpecificationContents1 Introduction .61.1 Prerequisites.61.2 Writing conventions .62 Product overview .72.1 Features.82.2 Block diagram .