JOINTINDUSTRYSTANDARDHandling, Packing,Shipping and Use ofMoisture/ReflowSensitive SurfaceMount DevicesIPC/JEDEC J-STD-033AJuly 2002Supersedes IPC/JEDEC J-STD-033April 1999 NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. For Technical Information Contact: JEDEC Solid State Technology Association 2500 Wilson Boulevard Arlington, VA 22201-3834 Phone 703.907.7560 Fax 703.907.7583 IPC 2215 Sanders Road Northbrook, IL 60062-6135 Phone 847.509.9700 Fax: 847.509.9798 Please use the Standard Improvement Form shown at the end of this document. Copyright 2002. JEDEC, Arlington, Virginia, and IPC, Northbrook, Illinois. All rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials without prior written consent of the copyright holders is strictly prohibited and constitutes infringement under the Copyright Law of the United States. IPC/JEDEC J-STD-033AHandling, Packing,Shipping and Use ofMoisture/ReflowSensitive SurfaceMount DevicesAjointstandarddevelopedbytheJEDECJC-14.1CommitteeonReliability Test Methods for Packaged Devices and the B-10a PlasticChip Carrier Cracking Task Group of IPCUsers of this standard are encouraged to participate in thedevelopment of future revisions.Contact:JEDECPublications Department2500 Wilson BoulevardArlington, VA 22201Phone(703)907-7559Fax(703)907-7583IPC2215 Sanders RoadNorthbrook, IL 60062-6135Phone (847) 509-9700Fax (847) 509-9798Supersedes:IPC/JEDEC J-STD-033 -April 1999JEDEC JEP124IPC-SM-786A - January 1995IPC-SM-786 - December 1990ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES August 9, 2002IPC/JEDEC J-STD-033A July 2002 ACKNOWLEDGEMENT Members of the Joint IPC-JEDEC Moisture Classification Task Group have worked to develop this document. We would like to thank them for their dedication to this effort. Any Standard involving a complex technology draws material from a vast number of sources. The material in this joint standard was developed by the JEDEC JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices and the IPC Plastic Chip Carrier Cracking Task Group (B-10a). This document was approved by the JEDEC Board of Directors under Board Ballot JCB-02-73, August 2002. ii Table of Contents1 FOREWORD. 11.1 Purpose . 11.2 Scope . 11.2.1 Packages . 11.3 Assembly Processes . 11.3.1 Mass Reflow. 11.3.2 Localized Heating . 11.3.3 Socketed Components. 11.3.4 Point-to-Point Soldering . 11.4 Reliability . 21.5 Terms and Definitions . 21.5.1 Active Desiccant . 21.5.2 Bar Code Label. 21.5.3 Bulk Reflow . 21.5.4 Carrier. 21.5.5 Desiccant . 21.5.6 Floor Life . 21.5.7 Humidity Indicator Card (HIC). 21.5.8 Manufacturers Exposure Time (MET). 21.5.9 Moisture Barrier Bag (MBB) . 21.5.10 Rework