AD7705 的布线规则翻译，有几点不懂，请指点1.Avoid running DIGITAL LINEs under the DEVICE, because they couple noise onto the die.避免数字线布在芯片下，因为会将噪声耦合到 die? 2.The ANALOG ground plane should be allowed to run under the AD7705/AD7706 to avoid noise coupling. 模拟地可以布在芯片下，以避免噪声耦合。3.The POWER supply LINEs to the AD7705/AD7706 should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the POWER supply LINE.尽量加宽电源线，可以提供低阻抗，和降低电源线上的短时脉冲。4. FAST switching signals, such as clock signals, should be shielded with DIGITAL ground to avoid radiating noise to other sections of the board, and clock signals should never be run near the ANALOG inputs. 快速切换的信号，例如时钟信号，应该包地，以避免将噪声辐射到其他部分。shielded with DIGITAL ground 是包地吗？4.Avoid crossover of DIGITAL and ANALOG signals.避免数字和模拟信号交叉。数字和模拟信号如何交叉？数字信号在电路板正面，模拟信号在电路板反面，这是交叉的意思吗？如果不是，能给个图演示一下吗 5.Traces on opposite sides of the board should run at right angles to each other.完全不懂是什么意思？6. This reduces the effects of feedthrough through the board.这会降低feedthroug h 影响?7. Using a microstrip technique works best, but it is not always possible to use this method with a double-sided board. In this technique, the component side of the board is dedicated to ground planes, and signals are placed on the solder side.使用微带技术最好不过了，（什么是 microstrip technique？）但在双层电路板，使用这种方法不是总有可能。使用这种技术，有元器件的一边铺地，信号布在反面。2 楼： 参与讨论 作者： adamzhao 于 2006-2-9 14:38:00 发布： -部分答案1.Avoid running DIGITAL lines under the DEVICE, because they couple noise onto the die.避免在芯片（AD7705）下面走数字线，因为它们会把噪声耦合到裸片上。die：就是 ic 未封装前的晶粒,是从硅晶片(wa fer)上用激光切割下,把 die 焊在框架上,再在 die 上面焊接上金线后形成 ic 裸芯片,再拿去塑封.4. FAST switching signals, such as clock signals, should be shielded with DIGITAL ground to avoid radiating noise to other sections of the board, and clock signals should never be run near the ANALOG inputs. 快速切换的信号，例如时钟信号，应该用地线屏蔽，以避免将噪声辐射到其他部分。5.Traces on opposite sides of the board should run at right angles to each other.板子正反两面的布线应该成直角3 楼： 参与讨论 作者： computer00 于 200 6-2-9 15:07:00 发布： -RE 一下：1.Avoid running DIGITAL LINEs under the DEVICE, because they couple noise onto the die.避免数字线布在芯片下，因为会将噪声耦合到 die? die 应该是芯片内部的硅片，有核心的意思2.The ANALOG ground plane should be allowed to run under the AD7705/AD7706 to avoid noise coupling. 模拟地可以布在芯片下，以避免噪声耦合。模拟地应布在芯片的下方，以消除噪声的耦合（利用地隔离，避免噪声耦合到芯片的内部）。3.The POWER supply LINEs to the AD7705/AD7706 should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the POWER supply LINE.尽量加宽电源线，可以提供低阻抗，和降低电源线上的短时脉冲。AD7705/AD7706 的电源走线应该尽量的宽，以提供低阻抗，及减少电源线上的毛刺。4. FAST switching signals, such as clock signals, should be shielded with DIGITAL ground to avoid radiating noise to other sections of the board, and clock signals should never be run near the ANALOG inputs. 快速切换的信号，例如时钟信号，应该包地，以避免将噪声辐射到其他部分。shielded with DIGITAL ground 是包地吗？高速信号，如时钟信号，应该使用地线作为屏蔽（包地），以避免噪声辐射到板上其它部分。另外，时钟信号千万不要布在模拟信号输入端附近。4.Avoid crossover of DIGITAL and ANALOG signals.避免数字和模拟信号交叉。数字和模拟信号如何交叉？数字信号在电路板正面，模拟信号在电路板反面，这是交叉的意思吗？如果不是，能给个图演示一下吗 避免交叉的意思，就是使模拟信号跟数字信号远离，不要混在一块儿。5.Traces on opposite sides of the board should run at right angles to each other.完全不懂是什么意思？层与层之间的走线，应该要有正确的夹角。（例如，顶层尽量横向走线，而底层则尽量纵向走线）6. This reduces the effects of feedthrough through the board.这会降低 feedthrough影响?这样可以减少通过电路板的馈通影响。（电路板的馈通是指，由于电路板的漏电、分布电容等，会传递信号）7. Using a microstrip technique works best, but it is not always possible to use this method with a double-sided board. In this technique, the component side of the board is dedicated to ground planes, and signals are placed on the solder side.使用微带技术最好不过了，（什么是 microstrip technique？）但在双层电路板，使用这种方法不是总有可能。使用这种技术，有元器件的一边铺地，信号布在反面。使用微带线技术（来设计的板）效果最好，但在双层板中，这不是总可能做到的。在这种方法中，元件面全部铺地作为地平面，而信号线则被布在焊接层。