ABP ELECTRONICS LIMITEDPCBPCB生产流程分享生产流程分享制作:Justin Yi审核:Mike ZhengABP ELECTRONICS LIMITEDUsageABP ELECTRONICS LIMITEDProcess裁板钻孔PTH外层SES AOI外层钻靶孔压膜O/L SES棕黑化I/L DES电镀外层压合冲孔I/L AOI防焊化金ABP ELECTRONICS LIMITED文字成型测试终检成仓ABP ELECTRONICS LIMITED叠构（Stack up)铜箔厚度 介层厚度 材料ABP ELECTRONICS LIMITEDABP ELECTRONICS LIMITEDMin L/W & SpacingABP ELECTRONICS LIMITED裁板ABP ELECTRONICS LIMITED压膜ABP ELECTRONICS LIMITEDI/L DESABP ELECTRONICS LIMITED冲孔ABP ELECTRONICS LIMITEDI/L AOIABP ELECTRONICS LIMITED棕黑化ABP ELECTRONICS LIMITED外层压合ABP ELECTRONICS LIMITED钻靶孔ABP ELECTRONICS LIMITEDPTHABP ELECTRONICS LIMITED钻孔ABP ELECTRONICS LIMITED外层ABP ELECTRONICS LIMITED电镀ABP ELECTRONICS LIMITED外层SESABP ELECTRONICS LIMITEDSES AOIABP ELECTRONICS LIMITED防焊前处理丝网印刷预烤，烘烤曝光显影ABP ELECTRONICS LIMITED化金ABP ELECTRONICS LIMITED文字ABP ELECTRONICS LIMITED成型ABP ELECTRONICS LIMITEDETABP ELECTRONICS LIMITEDFQCABP ELECTRONICS LIMITEDABP ELECTRONICS LIMITEDThe End