Contents of diagram belongs to HuangLiang,Copyright reserved by HL, No distribution,1,元器件封装知识,新能源检测与控制研究中心,电阻、电容、二极管贴片封装,Contents of diagram belongs to HuangLiang,Copyright reserved by HL, No distribution,2,0201 1/20W 0402 1/16W 0603 1/10W 0805 1/8W 1206 1/4W,0805封装,Contents of diagram belongs to HuangLiang,Copyright reserved by HL, No distribution,3,DIP封装,Dual In-line Package双列直插式封装,Contents of diagram belongs to HuangLiang,Copyright reserved by HL, No distribution,4,SOP封装,Small Out-Line Package小外形封装 表面贴装型封装之一，引脚从封装两侧引出呈海鸥翼状(L 字形)。,Contents of diagram belongs to HuangLiang,Copyright reserved by HL, No distribution,5,LCC封装,PLCC(Plastic Leaded Chip Carrier),带引线的塑料芯片载体。引脚从封装的四个侧面引出，呈丁字形，是塑料制品。,Contents of diagram belongs to HuangLiang,Copyright reserved by HL, No distribution,6,+,=,QFP封装,Plastic Quad Flat Package方型扁平式封装 该技术实现的CPU芯片引脚之间距离很小，管脚很细，一般大规模或超大规模集成电路采用这种封装形式,Contents of diagram belongs to HuangLiang,Copyright reserved by HL, No distribution,7,PGA封装,PGA（Ceramic Pin Grid Array Package），插针网格阵列封装。芯片内外有多个方阵形的插针，每个方阵形插针沿芯片的四周间隔一定距离排列，安装时将芯片插入专门的PGA插座。,Contents of diagram belongs to HuangLiang,Copyright reserved by HL, No distribution,8,BGA封装,Ball Grid Array Package球栅阵列封装,Contents of diagram belongs to HuangLiang,Copyright reserved by HL, No distribution,9,