WIRE BOND PROCESS INTRODUCTION,CONTENTS,ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT,封裝簡介,晶片Die,金線 Gold Wire,導線架 Lead fram,Wafer Grinding,Die Bonding,Wafer Saw,toaster,Wire Bonding,Die Surface Coating,Molding,Laser Mark,Solder Ball Placement,Singulation,Packing,封裝流程,Dejunk TRIM,Solder Plating,Solder Plating,Dejunk TRIM,TRIM/ FORMING,BGA,SURFACE MOUNTPKG,THROUGH HOLE PKG,Wire Bond 原理,pad,lead,Gold wire,Ball Bond ( 1st Bond ),Wedge Bond ( 2nd Bond ),Al,B.PRINCIPLE,銲接條件,HARD WELDING Pressure (Force) Amplify & Frequecy Welding Time (Bond Time) Welding Tempature (Heater) THERMAL BONING Thermal Compressure Ultrasonic Energy (Power),Bond Head ASSY,Low impact force Real time Bonding Force monitoring High resolution z-axis position with 2.5 micron per step resolution Fast contact detection Suppressed Force vibration Fast Force response Fast response voice coil wire clamp,X Y Table,Linear 3 phase AC Servo motor High power AC Current Amplifier DSP based control platform High X-Y positioning accuracy of +/- 1 mm Resolution of 0.2 mm,W/H ASSY,changeover Fully programmable indexer & tracks Motorized window clamp with soft close feature Output indexer with leadframe jam protection feature Tool less conversion window clamps and top plate enables fast device,Eagle,Bonding System Bonding Method Thermosonic (TS) BQM Mode Constant Current, Voltage, Power and Normal (Programmable) Loop Type Normal, Low, Square & J XY Resolution 0.2 um Z Resolution (capillary travelling motion)2.5 um Fine Pitch Capability 35 mm pitch 0.6 mil wire No. of Bonding Wires up to 1000 Program Storage 1000 programs on Hard Disk Multimode Transducer System Programmable profile, control and vibration modes,MACHINE SPECIFICATIONS (I),Eagle,Vision System Pattern Recognition Time 70 ms / point Pattern Recognition Accuracy + 0.37 um Lead Locator Detection 12 ms / lead (3 leads/frame) Lead Locator Accuracy + 2.4 um Post Bond Inspection First Bond, Second Bond Wire Tracing Max. Die Level Different 400 500 um Facilities Voltage 110 VAC (optional 100/120/200/210/ 220/230/240 VAC,MACHINE SPECIFICATIONS (II),Eagle,Material Handling System Indexing Speed 200 250 ms 0.5 “ pitch Indexer Resolution 1um Leadframe Position Accuracy + 2 mil Applicable Leadframe W = 17 75 mm bonding area in Y = 65mm = 17 90 mm bonding area in Y = 54mm L = 280 mm Maximum T = 0.075 0.8 mm Applicable Magazine W = 100 mm (Maximum) L = 140 300 mm H = 180 mm (Maximum) Magazine Pitch 2.4 10 mm (0.09” 0.39 “) Device Changeover 4 minutes Package Changeover 5 minutes Number of Buffer Magazine 3 (max. 435 mm),MACHINE SPECIFICATIONS (III),Bonding Process,The Wire Bond Temp,PREHEAT BONDSITE CU L/F200+/-10 200+/-10 AL L/F210+/-10 230+/-10 BGA 150+/-10 160+/-10 TFBGA150+/-10 160+/-10 LBGA 150+/-10 160+/-10 NOT INCLUDE DEDICATE LINE,pad,lead,Free air ball is captured in the chamfer,pad,lead,Free air ball is captured in the chamfer,SEARCH HEIGHT,pad,lead,Free air ball is captured in the chamfer,SEARCH SPEED1,SEARCH TOL 1,Free air ball is captured in the chamfer,pad,lead,SEARCH SPEED1,SEARCH TOL 1,Free air ball is captured in the chamfer,pad,lead,SEARCH TOL 1,SEARCH SPEED1,Free air ball is captured in the chamfer,pad,lead,SEARCH TOL 1,SEARCH SPEED1,Free air ball is captured in the chamfer,pad,lead,SEARCH TOL 1,SEARCH SPEED1,Formation of a first bond,pad,lead,SEARCH SPEED1,SEARCH TOL 1,Formation of a first bond,pad,lead,SEARCH SPEED1,SEARCH TOL 1,IMPACT FORCE,Formation of a first bond Contact,pad,lead,heat,PRESSURE,Ultra Sonic Vibration,Formation of a first bond Base,pad,lead,Ultra Sonic Vibration,heat,PRESSURE,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position,pad,lead,RH,Formation of a loop,pad,lead,RD (Reverse Distance),Formation of a loop,pad,lead,pad,lead,pad,lead,Calculated Wire Length,WIRE CLAMP CLOSE,pad,lead,Calculated Wire Length,pad,lead,SEARCH DELAY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,TRAJECTORY,pad,lead,2nd Search Height,Sea