资源预览内容
第1页 / 共27页
第2页 / 共27页
第3页 / 共27页
第4页 / 共27页
第5页 / 共27页
第6页 / 共27页
第7页 / 共27页
第8页 / 共27页
第9页 / 共27页
第10页 / 共27页
亲,该文档总共27页,到这儿已超出免费预览范围,如果喜欢就下载吧!
资源描述
9,825,461,087,6410,916,000,008,00M.Chbat,S.Eberlin,M.Tochtermann,T.JuhnkehiT7500Multi-HaulDWDMsystemProductReliabilityUpdateProcesses,Status,andMeasuresSept15,2004Information and Communication Networks9,825,461,087,6410,916,000,008,00SiemensReliabilityProcessOverviewOpticalComponents:EDFAVOAGTCPassivesNegotiationswithsuppliers:ModelingFieldexperienceSuppliercomparisonElectricalComponents:ResistorsCapacitorsTransistorsICsetc.Standards:SN29500IEC61709MechanicalComponents:ConnectorsBoardsetc.Standards:SN29500IEC61709CardFITRateFeedbackfromFieldReturnRateInformation and Communication Networks9,825,461,087,6410,916,000,008,00ProductReliabilityAssuranceProcessReference : Siemens standard; in agreement with international standards IEC 61709product definitionproduct developmentproduct deliveredrequirements aligned with technology basis failure rate allocation to individual cards involvement of component engineering & QAcard failure rates on basis of parts listscomponent rating by designnew & critical components specificationnew components & supplier auditsin production failure controlfield return analysis & threshold monitoringconservative data based on predicted valuesregular component supplier auditsInformation and Communication Networks9,825,461,087,6410,916,000,008,00Information and Communication Networks9,825,461,087,6410,916,000,008,00PredictedFITratesvs.fieldreturnFITratesField return FIT rate inherently is (!) lower than predicted FIT rate nspare parts dont contribute to FMAnnon-installed equipment at certain carriersnlow channel count for many yearsntemperature for FIT estimation probably higher than in realitynmargin (e.g., due to low channel count, low PMD, BOL) can mask performance degradationInformation and Communication Networks9,825,461,087,6410,916,000,008,00FunctionalPartitionofOLIOptical amplification via EDFA gain blocknPump diodesnMonitor diodesnEDF-HeaternInternal Gain SwitchOSC splitting functions asnAdd / Drop of the OSC channel using wavelength selective couplersnSplitting of monitor signals at the input and output port and at intermediate measurement pointsSpectral shaping of the signal using anVOA for setting the EDFA to an optimized operating pointnGTC for tilt compensationOptical monitor ports at input and output for signal supervisionAPSD circuitryGain Control and Supervision (DSP, on-board processor)Electrical components for control and power supplyMechanics including PCBInformation and Communication Networks9,825,461,087,6410,916,000,008,00012345678910111213OperatingtimeTinyearsFailureratel Early failuresltotalWear-out failureThebathtubcurve:FailurerateslviatimeTRandomfailureForthefieldreplaceableHW-unitsandtheircomponentsthefailureratel couldbeonlypredictedbyrandomfailures!TheunitofthefailureratelisaFIT(Failure in Time; 1FIT=1Failureper109h)!BathtubCurveInformation and Communication Networks9,825,461,087,6410,916,000,008,00IEC61709:ElectroniccomponentsReliabilityReferenceconditionsforfailureratesandstressmodelsforconversion(no basic failure rates)RelationshipbetweenStandardsSIEMENSstandardSN29500/IEC61709comparedtoSR-332SR-332:ReliabilityPredictionProcedureforElectronicEquipmentSN29500:FailureratesofcomponentsExpectedvalues(This is in addition to IEC 61709)a)Climaticandmechanicalstressesper IEC 721-3-3 (see next slide)multiplying factors for environmentalconditionsb)Qualityfactortested components SN725004 quality levels knownc)Temperatureandelectricalstressby reference conditions IEC 61709given reference conditions and conversion (SR-332)Information and Communication Networks9,825,461,087,6410,916,000,008,00IEC61709:ElectroniccomponentsReliabilityReferenceconditionsforfailureratesandstressmodelsforconversionThefailurerateunderoperatingconditionsiscalculatedasfollows:Wherelrefis the failure rate under reference conditions;pUis the voltage dependence factor;pIis the current dependence factor;pTis the temperature dependence factor.These Parameter are listed e.g in the SN29000 library!ReferenceconditionsforclimaticandmechanicalstressesTypeofstressReferencecondition1)qamb,ref=40CClimaticconditionsClass3K3asperIEC721-3-3MechanicalstressClass3M3asperIEC721-3-3Specialstresses3)NoneFor details of notes (-1, -2,-3) please refer to IEC 61709Ambienttemperature2)Thedefinitions,referenceconditionsandconversionmodelsusedintheIEC61709fullycorrespondwiththealreadyexistingSIEMENSstandardSN29500method.Details:SIEMENSStandardSN29500andIEC61709Information and Communication Networks9,825,461,087,6410,916,000,008,00FITRatesofIndividualElectricalComponents(1)VoltagedependenceandCurrentdependenceoror(1)(2)UOperating voltage in VUrefReference voltage in VUmaxRated voltage in VC1Constant in (1/V)C2C2,C3Constants(1).Digital CMOS Families, Contactors (2).OthersIOperating current in AIrefReference current in AImaxRated current in AC4,C5ConstantsInformation and Communication Networks9,825,461,087,6410,916,000,008,00FITRatesofIndividualElectricalComponents(2)AConstantEa1,Ea2Activation energies in eVTU,refReference
收藏 下载该资源
网站客服QQ:2055934822
金锄头文库版权所有
经营许可证:蜀ICP备13022795号 | 川公网安备 51140202000112号