1 backplane 背板2 Band gap voltage reference 带隙电压参考3 bench top supply 工作台电源4 Block Diagram 方块图5 Bode Plot 波特图6 Bootstrap 自举7 Bottom FET Bottom FET8 bucket capacitor 桶形电容9 chassis 机架10 Combi-sense Combi-sense11 constant current source 恒流源12 Core Saturation 铁芯饱和13 crossover frequency 交叉频率14 current ripple 纹波电流15 Cycle by Cycle 逐周期16 cycle skipping 周期跳步17 Dead Time 死区时间18 DIE Temperature 核心温度19 Disable 非使能，无效，禁用，关断20 dominant pole 主极点21 Enable 使能，有效，启用22 ESD Rating ESD额定值23 Evaluation Board 评估板24 Exceeding the specifications below may result in permanent damage to the device, ordevice malfunction. Operationoutsideof the parameters specified in the Electrical Characteristics section is notimplied. 超过下面的规格使用可能引起永久的 设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。25 Failing edge 下降沿26 figure of merit 品质因数27 float charge voltage 浮充电压28 fly back power stage 反驰式功率级29 forward voltage drop 前向压降30 free-running 自由运行31 Freewheel diode 续流二极管32 Full load 满负载33 gate drive 栅极驱动34 gate drive stage 栅极驱动级35 gerber plot Gerber 图36 ground plane 接地层37 Henry 电感单位：亨利38 Human Body Model 人体模式39 Hysteresis 滞回40 inrush current 涌入电流41 Inverting 反相42 jittery 抖动43 Junction 结点44 Kelvin connection 开尔文连接45 Lead Frame 引脚框架46 Lead Free 无铅47 level-shift 电平移动48 Line regulation 电源调整率49 load regulation 负载调整率50 Lot Number 批号51 Low Dropout 低压差52 Miller 密勒53 node 节点54 Non-Inverting 非反相55 novel 新颖的56 off state 关断状态57 Operating supply voltage 电源工作电压58 out drive stage 输出驱动级59 Out of Phase 异相60 Part Number 产品型号61 pass transistor pass transistor62 P-channel MOSFET P沟道 MOSFET63 Phase margin 相位裕度64 Phase Node 开关节点65 portable electronics 便携式电子设备66 power down 掉电67 Power Good 电源正常68 Power Groud 功率地69 Power Save Mode 节电模式70 Power up 上电71 pull down 下拉72 pull up 上拉73 Pulse by Pulse 逐脉冲Pulse by Pulse74 push pull converter 推挽转换器75 ramp down 斜降76 ramp up 斜升77 redundant diode 冗余二极管78 resistive divider 电阻分压器79 ringing 振 铃80 ripple current 纹波电流81 rising edge 上升沿82 sense resistor 检测电阻83 Sequenced Power Supplys 序列电源84 shoot-through 直通，同时导通85 stray inductances. 杂散电感86 sub-circuit 子电路87 substrate 基板88 Telecom 电信89 Thermal Information 热性能信息90 thermal slug 散热片91 Threshold 阈值92 timing resistor 振荡电阻93 Top FET Top FET94 Trace 线路，走线，引线95 Transfer function 传递函数96 Trip Point 跳变点97 turns ratio 匝数比，Np / Ns。 初级匝数/次级匝数98 Under Voltage Lock Out (UVLO) 欠压锁定99 Voltage Reference 电压参考100 voltage-second product 伏秒积101 zero-pole frequency compensation 零极点频率补偿102 beat frequency 拍频103 one shots 单击电路104 scaling 缩放105 ESR 等效串联电阻106 Ground 地电位107 trimmed bandgap 平衡带隙108 dropout voltage 压差109 large bulk capacitance 大容量电容110 circuit breaker 断路器111 charge pump 电荷泵112 overshoot 过冲LED 照明常用词汇中英文对照 2(1)元件设备三绕组变压器：three-column transformer ThrClnTrans双绕组变压器：double-column transformer DblClmnTrans电容器：Capacitor并联电容器：shunt capacitor电抗器：Reactor母线：Busbar输电线：TransmissionLine发电厂：power plant断路器：Breaker刀闸(隔离开关)：Isolator分接头：tap电动机：motor2 状态参数有功：active power无功：reactive power电流：current容量：capacity电压：voltage档位：tap position有功损耗：reactive loss无功损耗：active loss功率因数：power-factor功率：power功角：power-angle电压等级：voltage grade空载损耗：no-load loss铁损：iron loss铜损：copper loss空载电流：no-load current阻抗：impedance正序阻抗：positive sequence impedance负序阻抗：negative sequence impedance零序阻抗：zero sequence impedance电阻：resistor电抗：reactance电导：conductance电纳：susceptance无功负载：reactive load 或者 QLoad有功负载: active load PLoad遥测：YC(telemetering)遥信：YX励磁电流(转子电流)：magnetizing current定子：stator功角：power-angle上限:upper limit下限：lower limit并列的：apposable高压: high voltage低压：low voltage中压：middle voltage电力系统 power system发电机 generator励磁 excitation励磁器 excitor电压 voltage电流 current母线 bus变压器 transformer升压变压器 step-up transformer高压侧 high side输电系统 power transmission system输电线 transmission line固定串联电容补偿 fixed series capacitor compensation稳定 stability电压稳定 voltage stability功角稳定 angle stability暂态稳定 transient stability电厂 power plant能量输送 power transfer交流 AC装机容量 installed capacity电网 power system落点 drop point开关站 switch station双回同杆并架 double-circuit lines on the same tower变电站 transformer substation补偿度 degree of compensation高抗 high voltage shunt reactor无功补偿 reactive power compensation故障 fault调节 regulation裕度 magin三相故障 three phase fault故障切除时间 fault clearing time极限切除时间 critical clearing time切机 generator triping高顶值 high limited value强行励磁 reinforced excitation线路补偿器 LDC(line drop compensation)机端 generator terminal静态 static (state)动态 dynamic (state)单机无穷大系统 one machine - infinity bus system机端电压控制 AVR电抗 reactance电阻 resistance功角 power angle有功功率 active power无功功率 reactive power功率因数 power factor无功电流 reactive current下降特性 droop characteristics斜率 slope额定 rating变比 ratio参考值 reference value电压互感器 PT分接头 tap下降率 droop rate仿真分析 simulation analysis传递函数 transfer function框图 block diagram受端 receive-side裕度 margin同步 synchronization失去同步 loss of synchronization阻尼 damping摇摆 swing保护断路器 circuit breaker电阻：resistance电抗：reactance阻抗：impedance电导：conductance电纳：susceptance导纳：admittance电感：inductance电容: capacitanceLED 照明常用词汇中英文对照 3printed circuit 印制电路printed wiring 印制线路printed board 印制板printed circuit board 印制板电路printed wiring board 印制线路板printed component 印制元件printed contact 印制接点printed board assembly 印制板装配board 板rigid printed board 刚性印制板flexible printed circuit 挠性印制电路flexible printed wiring 挠性印制线路flush printed board 齐平印制板metal core printed board 金属芯印制板metal base printed board 金属基印制板mulit-wiring printed board 多重布线印制板molded circuit board 模塑电路板discrete wiring board 散线印制板micro wire board 微线印制板buile-up printed board 积层印制板surface laminar circuit 外表层合电路板B2it printed board 埋入凸块连印制板chip on board 载芯片板buried resistance board 埋电阻板mother board 母板daughter board 子板backplane 背板bare board 裸板copper-invar-copper board 键盘板夹心板dynamic flex board 动态挠性板static flex board 静态挠性板break-away planel 可断拼板cable 电缆flexible flat cable (FFC) 挠性扁平电缆membrane switch 薄膜开关hybrid circuit 混合电路thick film 厚膜thick film circuit 厚膜电路thin film 薄膜thin film hybrid circuit 薄膜混合电路interconnection 互连conductor trace line 导线flush conductor 齐平导线transmission line 传输线crossover 跨交edge-board contact 板边插头stiffener 增强板substrate 基底real estate 基板面conductor side 导线面component side 元件面solder side 焊接面printing 印制grid 网格pattern 图形conductive pattern 导电图形non-conductive pattern 非导电图形legend 字符mark 标志base material 基材laminate 层压板metal-clad bade material 覆金属箔基材copper-clad laminate (CCL) 覆铜箔层压板composite laminate 复合层压板thin laminate 薄层压板basis material 基体材料prepreg 预浸材料bonding sheet 粘结片preimpregnated bonding sheer 预浸粘结片epoxy glass substrate 环氧玻璃基板mass lamination panel 预制内层覆箔板core material 内层芯板bonding layer 粘结层film adhesive 粘结膜unsupported adhesive film 无支撑胶粘剂膜cover layer (cover lay) 覆盖层stiffener material 增强板材copper-clad surface 铜箔面foil removal surface 去铜箔面unclad laminate surface 层压板面base film surface 基膜面adhesive faec 胶粘剂面plate finish 原始光洁面matt finish 粗面length wise direction 纵向cross wise direction 模向cut to size panel 剪切板ultra thin laminate 超薄型层压板A-stage resin A阶树脂B-stage resin B 阶树脂C-stage resin C 阶树脂epoxy resin 环氧树脂phenolic resin 酚醛树脂polyester resin 聚酯树脂polyimide resin 聚酰亚胺树脂bismaleimide-triazine resin 双马来酰亚胺三嗪树脂acrylic resin 丙烯酸树脂melamine formaldehyde resin 三聚氰胺甲醛树脂polyfunctional epoxy resin 多官能环氧树脂brominated epoxy resin 溴化环氧树脂epoxy novolac 环氧酚醛fluroresin 氟树脂silicone resin 硅树脂silane 硅烷 polymer 聚合物amorphous polymer 无定形聚合物crystalline polamer 结晶现象dimorphism 双晶现象copolymer 共聚物synthetic 合成树脂thermosetting resin 热固性树脂thermoplastic resin 热塑性树脂photosensitive resin 感光性树脂epoxy value 环氧值dicyandiamide 双氰胺binder 粘结剂adesive 胶粘剂curing agent 固化剂flame retardant 阻燃剂opaquer 遮光剂plasticizers 增塑剂unsatuiated polyester 不饱和聚酯polyester 聚酯薄膜polyimide film (PI) 聚酰亚胺薄膜polytetrafluoetylene (PTFE) 聚四氟乙烯reinforcing material 增强材料glass fiber 玻璃纤维E-glass fibre E 玻璃纤维D-glass fibre D 玻璃纤维S-glass fibre S 玻璃纤维glass fabric 玻璃布non-woven fabric 非织布glass mats 玻璃纤维垫yarn 纱线filament 单丝strand 绞股weft yarn 纬纱warp yarn 经纱denier 但尼尔warp-wise 经向thread count 织物经纬密度weave structure 织物组织plain structure 平纹组织grey fabric 坏布woven scrim 稀松织物bow of weave 弓纬end missing 断经mis-picks 缺纬bias 纬斜crease 折痕waviness 云织fish eye 鱼眼feather length 毛圈长mark 厚薄段split 裂缝twist of yarn 捻度size content 浸润剂含量size residue 浸润剂残留量finish level 处理剂含量size 浸润剂couplint agent 偶联剂finished fabric 处理织物polyarmide fiber 聚酰胺纤维aromatic polyamide paper 聚芳酰胺纤维纸breaking length 断裂长height of capillary rise 吸水高度wet strength retention 湿强度保留率whitenness 白度 ceramics 陶瓷conductive foil 导电箔copper foil 铜箔rolled copper foil 压延铜箔annealed copper foil 退火铜箔thin copper foil 薄铜箔adhesive coated foil 涂胶铜箔resin coated copper foil 涂胶脂铜箔composite metallic material 复合金属箔carrier foil 载体箔invar 殷瓦foil profile 箔剖面轮廓shiny side光面matte side粗糙面treated side处理面stain proofing防锈处理double treated foil双面处理铜箔shematic diagram 原理图logic diagram 逻辑图printed wire layout 印制线路布设master drawing 布设总图computer aided drawing 电脑辅助制图computer controlled display 电脑控制显示placement 布局routing 布线layout 布图设计rerouting 重布simulation 模拟logic simulation 逻辑模拟circit simulation 电路模拟timing simulation 时序模拟modularization 模块化layout effeciency 布线完成率MDF databse 机器描述格式数据库design database 设计数据库design origin 设计原点optimization (design) 优化设计predominant axis 供设计优化坐标轴table origin 表格原点mirroring 镜像drive file 驱动文件intermediate file 中间文件manufacturing documentation 制造文件queue support database 队列支撑数据库component positioning 元件安置graphics dispaly 图形显示scaling factor 比例因子scan filling 扫描填充rectangle filling 矩形填充region filling 填充域physical design 实体设计logic design 逻辑设计logic circuit 逻辑电路hierarchical design 层次设计top-down design 自顶向下设计bottom-up design 自底向上设计net 线网digitzing 数字化design rule checking 设计规则检查router (CAD) 走布线器net list 网络表subnet 子线网objective function 目标函数post design processing (PDP) 设计后处理interactive drawing design 交互式制图设计cost metrix 费用矩阵engineering drawing 工程图block diagram 方块框图moze 迷宫component density 元件密度traveling salesman problem 回售货员问题degrees freedom 自由度out going degree 入度incoming degree 出度manhatton distance 曼哈顿距离euclidean distance 欧几里德距离network 网络array 阵列segment 段logic 逻辑logic design automation 逻辑设计自动化separated time 分线separated layer 分层definite sequence 定顺序conduction (track) 导线通道conductor width 导线体宽度conductor spacing 导线距离conductor layer 导线层conductor line/space 导线宽度/间距conductor layer No.1 第一导线层round pad 圆形盘square pad 方形盘diamond pad 菱形盘oblong pad 长方形焊盘bullet pad 子弹形盘teardrop pad 泪滴盘snowman pad 雪人盘V-shaped pad V形盘annular pad 环形盘non-circular pad 非圆形盘isolation pad 隔离盘monfunctional pad 非功能连接盘offset land 偏置连接盘back-bard land 腹背裸盘anchoring spaur 盘址land pattern 连接盘图形land grid array 连接盘网格阵列annular ring 孔环component hole 元件孔mounting hole 安装孔supported hole 支撑孔unsupported hole 非支撑孔via 导通孔plated through hole (PTH) 镀通孔access hole 余隙孔blind via (hole) 盲孔buried via hole 埋孔buried blind via 埋,盲孔any layer inner via hole 任意层内部导通孔all drilled hole 全部钻孔toaling hole 定位孔landless hole 无连接盘孔interstitial hole 中间孔landless via hole 无连接盘导通孔pilot hole 引导孔terminal clearomee hole 端接全隙孔dimensioned hole 准尺寸孔via-in-pad 在连接盘中导通孔hole location 孔位hole density 孔密度hole pattern 孔图drill drawing 钻孔图assembly drawing 装配图datum referan 参考基准